PRINTED CIRCUIT BOARDS, HDI, IC SUBSTRATES

Circuit board manufacturing companies need to respond to industry demand for ever smaller and powerful devices for handheld, wearable and mobile electronics, as well as new applications in IoT, communication, automotive, medical and aerospace. In order to keep up, they advance toward Surface Mount Technology (SMT), Ball Grid Array (BGA), Flip Chip and High Density Interconnect (HDI) designs, which raises a number of information system challenges.

The CHALLENGES:

The progression of manufacturing technologies to support higher density packaging drives a need to upgrade to more intelligent process equipment and materials. New generation equipment requires a higher level of data integration for both receiving part programs and producing quality/as built data. This drives a need for a more integrated information system platform to support the higher level of complexity.

Historically, board manufacturers have integrated multiple manual, excel based and legacy computer systems to manage the information required to fabricate boards, including part programs for automated equipment and the ability to track what they actually build. As the complexity of these in house built systems increase, they can be overwhelmed by the rate of change, while increasing IT labor, support cost, and business risk.

As the global marketplace for manufacturing grows in size and complexity, assemblers are forced to innovate in order to remain competitive. As product design and supply chain processes become more digitized, PCB manufacturers must respond, becoming more digitally integrated themselves.

These challenges combined with shrinking operating margins drive PCB manufacturers to seek new ways to efficiently link the product introduction process with production while lowering costs and improving quality.

Speed, innovation, productivity & quality at lower cost

Critical Manufacturing MES for PCB addresses the unique challenges of PCB manufacturers. It enables manufacturers to connect to equipment, retain full visibility and traceability of process flow and routing, product details, in-plant logistics, engineering, exceptions and specifications. In addition, automated record keeping reduces the cost in time - and potential for human error - of manual approaches.

Industry 4.o scalable architecture

Based on a modern, modular architecture, Critical Manufacturing MES™ for PCB provides flexibility and agility ramp production and get products to market quickly while accurately recording manufacturing traceability and eliminating the labor, support costs and errors of legacy systems.

Solution Map

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Advanced modeling, deep Semiconductor specific functionality

Enable Plant modeling and increased visibility to allow companies across your supply chain to share information, ensure quality, comply with regulatory requirements, and reduce time to market

Deep application functionality allows product engineers to match bills of material to assembly steps, track input materials at point of use and accurately capture and analyze quality data

Unlimited Device connectivity allows fully integrated manual and automated process steps, storing results as electronic product genealogy

Efficiently manage process and product changes, reduce variability, and ramp both yield and production at lower cost in a single solution

Ensure closed-loop quality system processes with workflows for exceptions, non-conformances, OCAPs and all SOPs

Achieve full traceability and a Plant 3D digital twin for instant views of equipment location and status

Boost flexibility to easily model lines for high-mix, low volume, frequent changeovers

Speed new product introduction by improving quality and yield in a way that’s visible to engineering, production and R&D

Flexibility, agility and scalability

Maximum flexibility to design, model, deploy and monitor operations

Increased visibility to manage product flow within a company, or between companies in the supply chain

Easy equipment and device integration allowing electronic capture of quality data, including next generation IoT devices and sensors

Leverage Industrial IoT with a distributed architecture designed for Industry 4.0

Complete modular scalability for companies ranging from single site to global multi-site enterprise